Abstract:
Three-dimensional heterogeneous integration of different materials and devices to create new capabilities for microelectronics and quantum information is an area of growing opportunity. He will offer his thoughts on these opportunities. He will give an overview of his group's ongoing experiments that explore the underlying science. These are: (i) the spalling of "hard" materials such as SiC, diamond, and Yttrium Iron Garnet (YIG) for power electronics and quantum science; (ii) development of Er-doped solid state quantum emitters; (iii), our work on "direct-write" physical and chemical vapor deposition where they nano-fabricate an evaporator on chip and place it on a near field scanning stage—the intent here is to enable 3D write capabilities for microelectronics with mesoscale and nm resolutions.